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The International High-end Forum on Digital Twin


19th International Manufacturing Conference


Call for papersRound 1

October 15th-17th, 2021 Xi’an, China

 The International High-end Forum on Digital Twin


Driven by both multi-dimensional virtual models and fusion data, digital twin (DT) can be used to realize various services and application requirements on monitoring, simulation, prediction and optimization, through cyber-physical closed-loop interaction. It provides an effective means for observing, understanding, controlling, optimizing, and transforming the physical world. DT meets the national strategic needs that use information technology to empower the upgrading of manufacturing, and provides a feasible way for smart manufacturing. At present, DT has been applied in various fields, such as industrial production, smart cities, healthcare, aerospace, transportation, etc., and will have a huge impact. Therefore, digital twin has attracted much attention from academia, industry, finance, and government departments. The International High-end Forum on Digital Twin gathers world-renowned scholars to build a high-level international exchange platform and lead the innovation and development of science, technology and engineering in the DT field.

Instructions for authors

All papers should be written in English. Format of the papers should follow the template specified in the IMCC2021 website and submitted to the secretariat by mail.

Important dates

Deadline for abstracts: June 30th, 2021

Acceptance notice for abstracts: July 15th, 2021

Deadline for the full text: August 15th, 2021

Deadline for Revision: September 10th, 2021


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Important Dates

Deadline for abstracts:
June 30th, 2021
Acceptance notice for abstracts:
July 15th, 2021
Deadline for the full text:
August 15th, 2021
Notification of Acceptance and Revision:
August 25th, 2021
Deadline for Revision:
September 10th, 2021
Registration:
November 17th, 2021
Meeting date:
November 18th-19th, 2021
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